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We produce plasma source by using of discharge by 13.56MHz radio frequency or/and 2.45GHz Microwave power without electrode. Some Plasma source is available for ion and/or radical source.

13.56MHz Radio frequency discharge type

IRFS-500 RF radical source

This is used for doping , cleaning. This radical source is Inductive coupling 13.56MHz radio frequency discharge plasma type. This type does not use magnet, so can use with RHEED system. IRFS-500 is RF Power 500W with Auto tuning system.

Characteristics
The plasma can be observed by the viewing port behind.
This is can be in install high vacuum system by all metal seal.
This source can be installed in the cell port in MBE.
Specifications
RF Output Power  0-500W at 13.56MHz
Auto tuning available.
200 degree of centigrade bakable.
Gas inlet port ICF34
Install flange ICF114
Power AC 200 V 1.5 kVA,  Cooling water is needed(500 cc / min)


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Parts List

RF radical source, RF Power supply, RF Matching box with Auto tuning.

Accessory

Gas Mass Flow controller,  Optical Plasma monitor

2.45GHz Microwave discharge type

SMPS-101 Miniture Microwave Plasma Source

Specifications
Microwave Power  0-100W at 2.45GHz
Gas inlet port VCR 1/4
Install flange ICF70 or VCR 1/4

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EMRS-221 Plasma Source for radical (output dia. 1 inch)
EMIS-212 Plasma Source for ion beam (output dia. 2 inch) 

External plasma source
These plasma source can use for ion beam source which accelerate voltage is to 3 keV.

This source can be install to ICF-114 flange. High vacuum is available with all metal seal.

Characteristics
The plasma can be observed.
This is can be in install high vacuum system by all metal seal.
application : High quality oxide layer, etc

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Specifications
Microwave Power  0-200W at 2.45GHz
200 degree of centigrade bakable. (without magnet)
Gas inlet port ICF34
Install flange ICF114

IMIS201Q Internal Microwave Plasma Source

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EMIS201Q is the microwave plasma source to insert into the chamber. Insert length is from 150 mm to 300 mm.

Characteristics
Plasma chamber is composed of quartz. Plasma generates without contamination
low leakage of magnetic fields

Small and light weight design

Specifications
Microwave Power  0-200W at 2.45GHz
200 degree of centigrade bakable without magnet. (The magnet must be removed. A magnet is arranged on the side of the atmosphere.)
Gas inlet port ICF34 x2, and Axially port x1
Install flange ICF114

Optional Component

Acceleration power supply
Acceleration Electrode and lens
Mass flow system for ion source gas
etc ...

EMIS-401  Ion Radical source

This source can be install ICF-203 flange. High vacuum is available with all metal seal too.  

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Characteristics
Plasma chamber is composed of quartz. Plasma generates without contamination
Ion beam current is up to 0.2mA/cm2 (Microwave power 300W Accel Voltage 500V)
low leakage of magnetic fields

Small and light weight design

Specifications
Microwave Power  0-500W at 2.45GHz
200 degree of centigrade bakable without magnet.
Gas inlet port ICF34
Install flange ICF152

FMP500 Flat Plasma source

Large diameter (4"-8") micro wave discharged plasma source use for doping, cleaning. This plasma source has unique mechanism, and very light in weight.
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Specifications
Microwave Power  0-600W at 2.45GHz
Plasma source diameter 150mm or more
Uniformity 3% (by Sio2 etching)

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Simple schematic of FMP500
FMP500 introduces a microwave from the perimeter and magnetic field from the top surface. With this structure, FMP500 can get the stable and clean plasma at long time. The ignition is easy. Wide range of gas pressure, from 3 Pa to 10-2 Pa.

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Plasma view from Chamber

Farther infomation, Please send E-mail : mailto:info@arios.co.jp
Final up date: 2006/09/02